IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic CircuitsIPC T 50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC T 50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering,